Mary Tish Phillips is a full stack engineer building AI-powered products that people actually use.
I’m a Software Applications Engineer at HP. I own backend work on an AI-driven remediation system that now resolves 60% of support tickets, and I built AI recommendation and analysis features behind nine customer deals worth over $1.07M.
I sit on the committee guiding HP’s organization-wide AI adoption and governance. I build agents and skills that other teams use, write internal guides, mentor engineers (including senior engineers) on AI development, and mentor interns.
I studied Computer Science and History, with a minor in Mathematics, at Trinity University (3.9 CS GPA). Before engineering I spent eight years as a fashion model, signed with nine agencies worldwide.
Outside of work, you’ll find me on the tennis court, training for my next marathon, or on a yoga mat.
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Growing Up
Fort Worth, TX
Where I grew up alongside my older brother, also a software engineer.
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2013 — 2021
Fashion Model
Signed with nine agencies worldwide, working with Vogue, Vera Wang, Neiman Marcus and Celine.
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2021 — 2025
Trinity University
Earned a B.S. in Computer Science and History, with a minor in Mathematics.
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2023 — 2024
Internships
Completed summer internships at HP and BNSF Railway.
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2025 — Present
Full-Time at HP
Joined as a Software Applications Engineer, building AI-powered device remediation features.