Mary Tish Phillips, smiling, in a gray pinstripe blazer

Mary Tish Phillips is a full stack engineer building AI-powered products that people actually use.

I’m a Software Applications Engineer at HP. I own backend work on an AI-driven remediation system that now resolves 60% of support tickets, and I built AI recommendation and analysis features behind nine customer deals worth over $1.07M.

I sit on the committee guiding HP’s organization-wide AI adoption and governance. I build agents and skills that other teams use, write internal guides, mentor engineers (including senior engineers) on AI development, and mentor interns.

I studied Computer Science and History, with a minor in Mathematics, at Trinity University (3.9 CS GPA). Before engineering I spent eight years as a fashion model, signed with nine agencies worldwide.

Outside of work, you’ll find me on the tennis court, training for my next marathon, or on a yoga mat.

  1. Growing Up Fort Worth, TX

    Where I grew up alongside my older brother, also a software engineer.

  2. 2013 — 2021 Fashion Model

    Signed with nine agencies worldwide, working with Vogue, Vera Wang, Neiman Marcus and Celine.

  3. 2021 — 2025 Trinity University

    Earned a B.S. in Computer Science and History, with a minor in Mathematics.

  4. 2023 — 2024 Internships

    Completed summer internships at HP and BNSF Railway.

  5. 2025 — Present Full-Time at HP

    Joined as a Software Applications Engineer, building AI-powered device remediation features.

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